Amtech NC-559-ASM Flux Paste 100gm

Amtech NC-559-ASM Flux Paste 100gm   Amtech NC-559-ASM is a globally recognized, high-performance "No-Clean" tacky flux paste. It is specifically engineered for professional electronics repair, including BGA (Ball Grid Array) reballing, SMD rework, and smartphone motherboard repairs. The following table provides a comprehensive technical and commercial description of the product. Amtech NC-559-ASM Flux Paste (100g) Specification Table Attribute Description / Specification Model Number NC-559-ASM Brand Amtech (Inventec Performance Chemicals) Flux Type No-Clean Tacky Flux Classification ROL0 (Low activity, Rosin-based, 0 Halogen content) Physical State Gel-like Paste Color Pale Yellow / Translucent Net Weight 100 grams Packaging Type Jar (Wide-mouth container) Compatibility Leaded (Sn63/Pb37) and Lead-Free (SAC305) alloys Melting Point Approx. 50°C (Softening point of the resin) Boiling Point Approx. 300°C Halide Content Halogen-Free (<0.5%) Viscosity 40–52 (Malcom @ 10 RPM/25°C x10³ mPa/s) Surface Insulation Resistance (SIR) ?100 M? (After curing, remains non-conductive) Smoke Emission Low Smoke Generation Odor Mild, non-irritating UV Tracer Yes (Contains UV dye for inspection of residue) Shelf Life 12 Months (Refrigerated); 1-6 Months (Room Temp) Storage Temperature Recommended 3°C – 8°C (Do not freeze) Detailed Product Features 1. No-Clean Chemistry The "No-Clean" designation means the residue left after the soldering process is chemically inert, non-corrosive, and non-conductive. This eliminates the mechanical necessity of cleaning the PCB after rework, which is critical for high-density components where cleaners might get trapped. 2. Excellent Wetting and Thermal Stability It provides superior wetting properties, allowing solder to flow smoothly over pads and component leads. The flux remains stable under high temperatures, preventing premature "drying out" during extended hot air rework or infrared reflow cycles. 3. High Viscosity and "Tackiness" The paste has a high "tacky" consistency, which serves a functional purpose: it holds small SMD components and BGA spheres in place before the heat is applied. This prevents components from shifting due to air pressure from a hot air station. 4. Clear Residue with UV Tracer The residue remains clear and transparent after heating, allowing for easy visual inspection of the solder joints. The inclusion of a UV tracer allows quality control teams to use UV light to ensure the flux was applied and distributed correctly across the board. Primary Applications BGA Reballing: Ideal for attaching solder spheres to BGA chips (CPUs, GPUs, EMMC). Smartphone & Laptop Repair: Used for micro-soldering tasks on densely packed motherboards. SMD/SMT Rework: Perfect for removing and replacing surface-mount devices like resistors, capacitors, and ICs. Flip-Chip Attachment: Suitable for high-precision industrial semiconductor assembly. Usage and Handling Guidelines Application: Can be applied via syringe, stencil printing, or manually with a precision tool. Cleaning (Optional): While cleaning is not required, if a pristine aesthetic is needed, residues can be removed using Isopropyl Alcohol (IPA) or specialized aqueous flux cleaners. Safety: Always use in a well-ventilated area. While low-smoke, the fumes from any soldering process should be extracted using a fume extractor.